Low temperature sintering of nano silver paste

Low temperature sintering of nano silver paste

The low-temperature sintered nano silver slurry developed by SHAREX new material is composed of nano silver particles and other components. It has low-temperature sintering performance. By sintering it, printed circuits can be formed at low temperature.
It is especially suitable for printing organic substrates such as pet and PC films that cannot be sintered at high temperature. The product has the following characteristics:
1. The product is composed of nano silver particles, organic polymers and organic solvents;
2. Sintered silver with low resistance is formed by CO sintering in air (100 ℃ - 170 ℃). According to the sintering temperature, the volume resistance is as low as 4-5 * 10-6 ohms;

3. Circuit printing below 50um can be realized through screen printing;
4 printed circuit has high bending durability: even when the bending radius r = 0.5mm, the resistance value does not change after 100000 times of bending. (bending durability varies greatly according to different substrates.)